Calibre An artificial intelligence machine leaning (AI/ML) approach with cross-technology node learning for multi-layer process defect predictions

2024-03-18T12:05:27.000-0400
Manufacturing

Summary

This is the invited paper jointly presented by AMD and Siemens EDA at SPIE Advanced Lithography Conference 2024.

Details

See the attachment above for the presentation. 

KB Article ID# KB000130567_EN_US

Contents

SummaryDetails

Associated Components

Calibre SONR