2023-12-14T14:28:10.000-0500

Verification and Analysis

This article contains the video recording of the webinar delivered 07 DEC 2023 and the questions and answers from that webinar.

A: The 3D area needs to include the return path (vias) and the fields around the signals being modeled. Also, ensure that the boundary allows for TEM waves where it intersects the signal traces.

A: Integration in the analysis flow and a uniform GUI are major advantages for HLAS.

A: it is impossible to correctly estimate the simulation time of a solution. You can observe the time to simulate the first few frequencies and extrapolate the time from that time.

A: Use HLAS behind BoardSim to create the PDN + signal model. Then run the power-aware simulation in the DDRx Batch Wizard.

A: You can edit the parameters of the 3D area to omit the layers that are not relevant to the model.

A: See the Support Kit in the Support Center article **MG621713**. The visualization of current density is done manually with the HLAS GUI.

A: This solution is possible in some cases in HLAS. It would most likely be very computationally intense.

A: HLAS does not need adaptive meshing because it is optimized for PCB or package (planar) layout geometries. The correct mesh for these geometries can be determined before starting the solver.

A: HPC can use multiple threads and cores in your computer. This feature uses multiple licenses.

A: This is precisely what Lumped Decoupling Analysis creates. If you need more flexibility, you can do the same configuration in the Hybrid solver.

A: We recommend using 3D areas in BoardSim to solve the appropriate areas in 3D and then run Compliance Wizard or IBIS-AMI simulations on the channels.

A: There is no practical limit on the minimum resolution of the 3D model. The complexity of the geometry is a greater factor in creating more mesh elements.

A: See our **previous webinar on this topic**.

Q2: Using the automatic area creation feature does a good job of finding transitions but creates complicated areas. Does this affect computation times compared to manually drawing a simple rectangle?

A: 1: The mesher uses the boundary element method, so defining another boundary between dielectric layers increases the boundary mesh elements.

2: A smaller area generally has fewer mesh elements and thus will run the solution faster.

A: The easiest method to use the Advanced Solvers for full net modeling is to use the 3D Areas feature in BoardSim. This creates full 3D EM models of the areas that really need to have advanced models. A second option is to import the full layout into Hybrid solver, extract the S parameters of the net or nets of interest, and connect the resulting Touchstone file as desired in LineSim for the circuit simulation.

2) If we have a system in which the current has a different return path depending on the phase it is in, and we want to perform a co-simulation with the extracted S parameters and the rest of the electrical circuit, is it necessary to run two different electromagnetic simulations specifying a different return path and use one extraction rather than another depending on the case in which we are?

A: 1: It is feasible to generate S parameters of separate designs and then connect them in a circuit simulation. Be careful to place the ports as much as possible where the field propagation is TEM. As expected, this method cannot account for field coupling that might actually happen between the 2 designs.

2: The return path can be correctly modeled and simulated by placing a port on each phase of the multi-phase VRM.

2) How does HyperLynx ensure accurate modeling and extraction of parasitics?

3) Could you share specific instances or use cases demonstrating the practical applications of the HyperLynx Advanced Solvers?

A: 1) Advanced Solvers models the geometry in the 3D model, so if you enter the geometry of components into the 3D model, they will be included in the results. 2) The accuracy of the Advanced Solvers is constantly being evaluated and improved. The user still needs to have an idea of what to expect in order to determine if the results are acceptable. 3) The practical applications of the Advanced Solvers are pretty much any modeling of PCB or planar IC package layouts.

A: The most efficient method for this scenario is to generate 3D areas on the nets to simulate, solve the 3D areas with the FullWave solver, and then run the Compliance Wizard, or IBIS-AMI Simulation if you have the models.

A: FullWave and Hybrid solvers produce S parameters. The most effective method for this situation is to solve the 3D areas on the SerDes channels and then simulate them with IBIS-AMI models.

A: It is possible to edit the geometry in the Advanced Solvers, but it is not very efficient. For a small change like this, it might be reasonable. A better method is to create a sweep of the geometry using 3D Xplorer.

A: This issue is outside the realm of this webinar. Please continue to work with your local field AE and customer support to pursue a solution in job distribution.

A: We agree that this would be useful. Stay tuned for developments around job distribution.